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triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 1 april 2012 ? rev c product description the triquint tga4509-sm is a ka-band packaged 1w power amplifier. the tga4509-sm operates from 28-31 ghz and is designed using triquint?s power phemt production process. the tga4509-sm typically provides 30 dbm of output power at 1 db gain compression with small signal gain of 22 db. the tga4509-sm is available in a low- cost, surface mount 4x4 qfn style package and is ideally suited for ka- band vsat ground terminal, point-to- point radio and point-to-multipoint applications. evaluation boards are available upon request. lead-free and rohs compliant. primary applications ? ka-band vsat ground terminal ? point-to-point radio ? point-to-multipoint communications ka-band packaged 1w pa tga4509-sm key features ? frequency range: 28-31 ghz ? 30 dbm nominal p1db ? 22 db nominal gain ? bias conditions: vd = 6 v, idq_tot = 420 ma (id = 800ma under rf drive) ? compact 4 x 4 qfn with 20 leads ? package dimensions: 4.0 x 4.0 x 1.2 mm measured performance bias conditions: vd = 6v, idq = 420ma datasheet subject to change without notice
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 2 april 2012 ? rev c table i absolute maximum ratings 1 / symbol parameter value notes v + positive supply voltage 7 v v - negative supply voltage range -5v to 0v i + positive supply current 984 ma | i g | gate supply current 35 ma p in input continuous wave power 22 dbm p d power dissipation 6.9 w tchannel channel temperature 200 c 2 / mounting temperature (30 seconds) 260 c storage temperature -65 to 150 c 1 / these ratings represent the maximum operable values for this device. stress es beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device and / or affect device lifetime. these are stress ratings only, and functional operation of the device at these conditions is not implied. 2 / combinations of supply voltage, supply current, input power, and output power shall not exceed p d . tga4509-sm
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 3 april 2012 ? rev c table ii rf characterization table (t a = 25 c, nominal) bias conditions: vd = 6v, idq = 420ma symbol parameter test condition nominal units gain small signal gain f = 28-31 ghz 22 db irl input return loss f = 28-31 ghz 15 db orl output return loss f = 28-31 ghz 15 db psat saturated output power f = 28-31 ghz 30.5 dbm p1db output power @ 1db compression f = 28-31 ghz 30 dbm tga4509-sm
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 4 april 2012 ? rev c table iii thermal information parameter test condition tchannel ( c) jc ( c/w) tm (hrs) jc thermal resistance (channel to package) v d = 6v i dq = 420ma p d = 2.52 w 141 22.4 2.2 e+6 note: thermal transfer is from the backside of the package through the board. the board must be designed to assure adequate thermal transfer from the package. worst case condition is with no rf applied, 100% of dc power is dissipated. tga4509-sm median lifetime (tm) vs. channel temperature
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 5 april 2012 ? rev c measured performance bias conditions: vd = 6 v, idq = 420 ma tga4509-sm
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 6 april 2012 ? rev c measured performance bias conditions: vd = 6 v, idq = 420 ma tga4509-sm
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 7 april 2012 ? rev c package pinout diagram pin description 1, 5, 6, 10, 11, 15, 16, 20, 21 gnd 2, 4, 8, 12, 14, 18 nc 3 rf input 7 and/or 19 vg 9 and/or 17 1 / vd 13 rf output bottom view top view dot indicates pin 1 gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. tga 4509 date code lot code tga4509-sm 1 / drain voltage bias is r equired from both pin 9 and 17 for drain current, id > 650 ma.
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 8 april 2012 ? rev c gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. tga4509-sm mechanical drawing units: millimeters
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 9 april 2012 ? rev c gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. * the layout is a general purpose drawing that needs to be tuned for the specific application. pcb is ro4003 8 mil thickness, 0.5 oz standard copper cladding, with er = 3.38. recommended board layout assembly * tga4509-sm c2 c1 c3 c4 r1 c5 c6 part description c1, c2, c3, c4 0.01 uf capacitor (0402) c5, c6 1.0 uf capacitor (0402) r1 15 ohm resistor (0402) see recommended tuning board
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 10 april 2012 ? rev c recommended tuning board 52.5 52.5 20 x 32.5 20 x 32.5 all units are in mils
triquint semiconductor: www. triquint.c om (972)994-8465 fax (972)994-8504 info-mmw@tqs.com 11 april 2012 ? rev c ordering information part package style tga4509-sm qfn 4x4 surface mount gaas mmic devices are susceptible to damage from electrostatic discharge . proper precautions should be observed during handling, assembly and test. tga4509-sm recommended surface mount package assembly proper esd precautions must be followed while handling packages. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste c an be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. solder attach process requires the use of no clean flux. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 ? 120 sec @ 140 ? 160 c 60 ? 180 sec @ 150 ? 200 c time above melting point 60 ? 150 sec 60 ? 150 sec max peak temperature 240 c 260 c time within 5 c of peak temperature 10 ? 20 sec 10 ? 20 sec ramp-down rate 4 ? 6 c/sec 4 ? 6 c/sec

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